Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211304 | Assembly and method for mounting an electronic component to a substrate | Guenther Lohmann, Bernd Schmoelzer, Fabian Schnoy | 2021-12-28 |
| 10903133 | Method of producing an SMD package with top side cooling | Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2021-01-26 |
| 10896893 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2021-01-19 |
| 10892247 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2021-01-12 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |