Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211304 | Assembly and method for mounting an electronic component to a substrate | Ralf Otremba, Bernd Schmoelzer, Fabian Schnoy | 2021-12-28 |
| 10903133 | Method of producing an SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2021-01-26 |