Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152272 | Die-to-wafer hybrid bonding with forming glass | Je-Hsiung Lan, Jonghae Kim | 2021-10-19 |
| 11024728 | Monolithic self-aligned heterojunction bipolar transistor (HBT) and complementary metal-oxide-semiconductor (CMOS) | — | 2021-06-01 |
| 10950721 | Self-aligned high voltage transistor | — | 2021-03-16 |