Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158574 | Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC product | Julien Frougier, Keith Donegan, Hyung Woo Kim | 2021-10-26 |
| 11121087 | Methods of forming a conductive contact structure to an embedded memory device on an IC product and a corresponding IC product | Julien Frougier, Keith Donegan, Hyung Woo Kim | 2021-09-14 |
| 11114338 | Fully aligned via in ground rule region | Xunyuan Zhang | 2021-09-07 |
| 11101169 | Interconnect structures with airgaps arranged between capped interconnects | — | 2021-08-24 |
| 10978388 | Skip via for metal interconnects | Hari Prasad Amanapu, Prasad Bhosale, Lars Liebmann, James Jay McMahon, Cornelius Brown Peethala +1 more | 2021-04-13 |