Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Alexander Komposch | 2021-05-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Alexander Komposch | 2021-05-11 |