Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2021-05-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2021-05-11 |