Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11152325 | Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys | Kevin Shawne Schneider, Scott Sheppard | 2021-10-19 | $126,981,000 |
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Michael Lefevre | 2021-05-11 | $131,603,000 |