ML

Min-Tih Lai

IN Intel: 2 patents #1,147 of 5,160Top 25%
📍 Hanford, CA: #1 of 3 inventorsTop 35%
🗺 California: #13,721 of 66,859 inventorsTop 25%
Overall (2021): #130,269 of 548,734Top 25%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11171114 Die stack with cascade and vertical connections Florence R. Pon, Yuhong Cai, John G. Meyers 2021-11-09
10910301 Post-grind die backside power delivery Tyler Leuten, Florence R. Pon 2021-02-02