MH

Mi Sun Hwang

Samsung: 5 patents #1,184 of 16,990Top 7%
Overall (2021): #29,722 of 548,734Top 6%
5
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11183462 Substrate having electronic component embedded therein Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more 2021-11-23
11076487 Electronic component embedded substrate Deok-Man Kang, Jun Hyeong Jang 2021-07-27
11017930 Inductor Jin Gul Hyun 2021-05-25
11013114 Printed circuit board Seon Ha Kang, Sa Yong Lee, Ju Ho Kim 2021-05-18
10887986 Printed circuit board and method of manufacturing the same Sun-A KIM 2021-01-05