| 11158515 |
Selective metal removal for conductive interconnects in integrated circuitry |
Kevin Lin, Rahim Kasim, Florian Gstrein |
2021-10-26 |
| 11152254 |
Pitch quartered three-dimensional air gaps |
Sudipto Naskar, Stephanie A. Bojarski, Kevin Lin, Marie Krysak, Tristan A. Tronic +3 more |
2021-10-19 |
| 11011463 |
Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom |
Kevin Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani |
2021-05-18 |
| 10971394 |
Maskless air gap to prevent via punch through |
Todd R. Younkin, Eungnak Han, Jasmeet S. Chawla, Marie Krysak, Hui Jae Yoo +1 more |
2021-04-06 |
| 10937689 |
Self-aligned hard masks with converted liners |
Satyarth Suri, Tristan A. Tronic, Christopher J. Jezewski, Richard E. Schenker |
2021-03-02 |
| 10916499 |
Vias and gaps in semiconductor interconnects |
Kevin Lin |
2021-02-09 |
| 10892223 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, James M. Blackwell +6 more |
2021-01-12 |
| 10886175 |
Differentiated molecular domains for selective hardmask fabrication and structures resulting therefrom |
Eungnak Han, Rami Hourani, Florian Gstrein, Gurpreet Singh, Scott B. Clendenning +1 more |
2021-01-05 |