Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930550 | Barrier for copper metallization and methods of forming | Seshadri Ganguli, Sang Ho Yu | 2021-02-23 |
LC
Lu Chen
Overall (2021): #358,057 of 548,734Top 70%
1
Patents 2021