Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2021-11-23 |
| 11075156 | Substrate having electronic component embedded therein | Dae Jung Byun, Yong-duk Lee, Chang Hwa Park, Je Sang Park, Jin Won Lee | 2021-07-27 |