Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211397 | Three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-12-28 |
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2021-12-21 |
| 11145666 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Qian Tao, Yu Ru Huang +6 more | 2021-10-12 |
| 11133325 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Yushi Hu +4 more | 2021-09-28 |
| 11101276 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Zhenyu Lu, Jun Chen, Si Ping Hu, Xiaowang Dai, Lan Yao +4 more | 2021-08-24 |
| 11056387 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2021-07-06 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2021-06-29 |
| 11031333 | Three-dimensional memory devices having a plurality of NAND strings | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2021-06-08 |