Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11112103 | In mold electronic printed circuit board encapsulation and assembly | Terry G. Davis, David Rocco, Mikhail Sagal, Nicolas Sunderland, James M. Lorenzo +2 more | 2021-09-07 |
| 11104822 | Processes for In-Mold coating systems for molding, and products formed therefrom | Kurt E. Best, Robert Andrew Wade, Timothy Bish | 2021-08-31 |