Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11112103 | In mold electronic printed circuit board encapsulation and assembly | Terry G. Davis, David Rocco, Jessee McCanna, Nicolas Sunderland, James M. Lorenzo +2 more | 2021-09-07 |