Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11112103 | In mold electronic printed circuit board encapsulation and assembly | David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James M. Lorenzo +2 more | 2021-09-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11112103 | In mold electronic printed circuit board encapsulation and assembly | David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James M. Lorenzo +2 more | 2021-09-07 |