JA

Jean Audet

IBM: 2 patents #3,096 of 11,638Top 30%
Overall (2021): #151,336 of 548,734Top 30%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11209598 Photonics package with face-to-face bonding Barnim Alexander Janta-Polczynski, Isabel De Sousa, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire +2 more 2021-12-28
10949600 Semiconductor package floating metal checks Franklin M. Baez, Jason L. Frankel, Paul R. Walling 2021-03-16