Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201081 | Method for separating thin layers of solid material from a solid body | Wolfram Drescher | 2021-12-14 |
| 11130200 | Combined laser treatment of a solid body to be split | Ralf Rieske, Marko Swoboda | 2021-09-28 |
| 11059202 | Method and device for producing planar modifications in solid bodies | Ralf Rieske, Christian Beyer, Christoph Guenther, Marko Swoboda | 2021-07-13 |
| 11004723 | Wafer production method | Wolfram Drescher, Christian Beyer | 2021-05-11 |
| 10994442 | Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam | Marko Swoboda, Christian Beyer, Franz Schilling | 2021-05-04 |
| 10978311 | Method for thinning solid body layers provided with components | Wolfram Drescher, Marko Swoboda, Ralf Rieske, Christian Beyer | 2021-04-13 |
| 10960574 | Combined wafer production method with a receiving layer having holes | Christian Beyer, Anas Ajaj | 2021-03-30 |
| 10930560 | Laser-based separation method | Christian Beyer | 2021-02-23 |