Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211338 | Apparatus for stacking substrates and method for the same | Kazuya Okamoto, Hajime MITSUISHI, Minoru Fukuda | 2021-12-28 |
| 11004686 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano | 2021-05-11 |