Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004686 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda | 2021-05-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004686 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda | 2021-05-11 |