Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211338 | Apparatus for stacking substrates and method for the same | Isao Sugaya, Kazuya Okamoto, Hajime MITSUISHI | 2021-12-28 |
| 11004686 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano | 2021-05-11 |