Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910339 | Flip chip bonding method | Yongwon Choi, Myung-Sung Kang, Yeongseok Kim, Wonkeun Kim | 2021-02-02 |
HJ
Hwail Jin
Overall (2021): #427,721 of 548,734Top 80%
1
Patents 2021