Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183439 | Package structure for power device | Ching-Wen Liu | 2021-11-23 |
| 11177188 | Heat dissipation substrate for multi-chip package | Ching-Wen Liu | 2021-11-16 |
| 11133246 | Semiconductor structure employing conductive paste on lead frame | Chih-Yen Chen, Chun-Yi Wu, Chia-Ching Huang, Chih-Jen Hsiao, Wei-Chan Chang +1 more | 2021-09-28 |
| 11049796 | Manufacturing method of packaging device | Chia-Yen Lee, Peng-Hsin Lee | 2021-06-29 |
| 10892210 | Package structures | Peng-Hsin Lee | 2021-01-12 |