Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183439 | Package structure for power device | Hsin-Chang Tsai | 2021-11-23 |
| 11177188 | Heat dissipation substrate for multi-chip package | Hsin-Chang Tsai | 2021-11-16 |
| 10935043 | Assembly of blade assembly bracket and blade of ceiling fan | — | 2021-03-02 |