Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189555 | Chip packaging with multilayer conductive circuit | — | 2021-11-30 |
| 11049796 | Manufacturing method of packaging device | Hsin-Chang Tsai, Chia-Yen Lee | 2021-06-29 |
| 10892210 | Package structures | Hsin-Chang Tsai | 2021-01-12 |