Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037846 | Semiconductor package structure and method of manufacturing the same | Chien-Hua Chen, Cheng-Yuan KUNG, Hung-Yi Lin | 2021-06-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037846 | Semiconductor package structure and method of manufacturing the same | Chien-Hua Chen, Cheng-Yuan KUNG, Hung-Yi Lin | 2021-06-15 |