Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018115 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Tae Hong Min | 2021-05-25 |
| 10964670 | Semiconductor package and method of manufacturing the same | Taehyeong Kim, Young Lyong Kim | 2021-03-30 |