Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127627 | Method for forming an interconnection structure | Guillaume Bouche, Juergen Boemmels | 2021-09-21 |
| 10910259 | Semiconductor device manufacturing method | Koichi Yatsuda, Tatsuya Yamaguchi, Yannick Feurprier, Jean-Francois de Marneffe, Khashayar Babaei Gavan | 2021-02-02 |