Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081380 | Chip bonding device | Hai Xia, Yuebin Zhu, Hailin Cheng, Xiaoyu Jiang, Lili Zhao +1 more | 2021-08-03 |
| 11037900 | Chip bonding device and bonding method thereof | Song Guo, Jianqi SUN, Yuebin Zhu, Tianming Wang, Hai Xia | 2021-06-15 |
| 10903105 | Flip chip bonding device and bonding method | Yaping Ge, Song Guo, Jingchao Qi | 2021-01-26 |