Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081380 | Chip bonding device | Feibiao Chen, Hai Xia, Hailin Cheng, Xiaoyu Jiang, Lili Zhao +1 more | 2021-08-03 |
| 11037900 | Chip bonding device and bonding method thereof | Song Guo, Jianqi SUN, Feibiao Chen, Tianming Wang, Hai Xia | 2021-06-15 |