Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201154 | Methods of forming an apparatus including device structures including pillar structures, and related memory devices, and electronic systems | Sanh D. Tang, Shen Hu, Yan Li, Nicholas R. Tapias | 2021-12-14 |
| 11037900 | Chip bonding device and bonding method thereof | Jianqi SUN, Feibiao Chen, Yuebin Zhu, Tianming Wang, Hai Xia | 2021-06-15 |
| 10991700 | Methods of forming semiconductor devices using aspect ratio dependent etching effects, and related memory devices and electronic systems | Sanh D. Tang, Vlad Temchenko, Shivani Srivastava | 2021-04-27 |
| 10931196 | Load transient and jitter of DC-DC converter | — | 2021-02-23 |
| 10903105 | Flip chip bonding device and bonding method | Feibiao Chen, Yaping Ge, Jingchao Qi | 2021-01-26 |