Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069666 | Semiconductor package | Chui Kyu Kim, Jung Ho Shim, Jae Hyun Lim, Mi-Ja Han, Sang Jong Lee +1 more | 2021-07-20 |
| 11037884 | Semiconductor package having through-hole including shielding wiring structure | Yoon Seok Seo, Sang Jong Lee, Chul Kyu KIM, Jae Hyun Lim | 2021-06-15 |
| 10923433 | Fan-out semiconductor package | Mi-Ja Han, Seong Hwan Lee, Sang Jong Lee | 2021-02-16 |