Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Christian Lavoie, Stephen M. Rossnagel, Thomas M. Shaw | 2021-03-09 |
CH
Chao-Kun Hu
Overall (2021): #500,967 of 548,734Top 95%
1
Patents 2021