Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957816 | Thin film wafer transfer and structure for electronic devices | Can Bayram, Jack O. Chu, Jeehwan Kim, Hongsik Park, Devendra K. Sadana | 2021-03-23 |
CD
Christos D. Dimitrakopoulos
Overall (2021): #502,863 of 548,734Top 95%
1
Patents 2021