Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205575 | Method for stripping one or more layers from a semiconductor wafer | Byron Joseph Palla, Stephen A. Keller, Brian Edward Hornung, Douglas Ticknor Grider | 2021-12-21 |
| 11205578 | Dopant anneal with stabilization step for IC with matched devices | Kenneth Palomino, Mahalingam Nandakumar | 2021-12-21 |