Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205575 | Method for stripping one or more layers from a semiconductor wafer | Byron Joseph Palla, Brian Edward Hornung, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2021-12-21 | $36,896,000 |