Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205575 | Method for stripping one or more layers from a semiconductor wafer | Byron Joseph Palla, Stephen A. Keller, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2021-12-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205575 | Method for stripping one or more layers from a semiconductor wafer | Byron Joseph Palla, Stephen A. Keller, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2021-12-21 |