Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11131510 | Heat pipe structure | Yi-Lun Cheng, Meng-Lung Chiang | 2021-09-28 |
| 11127756 | Three-dimensional memory device and manufacturing method thereof | Tzung-Ting Han | 2021-09-21 |
| 11088445 | Antenna assembly with compact layout traces | De-Chang Su | 2021-08-10 |
| 10948246 | Heat dissipation system | Shin-Hsin Hsien | 2021-03-16 |
| 10921062 | Cooling fan and heat dissipating module including the same | Yi-Lun Cheng | 2021-02-16 |
| 10901471 | Heat dissipation assembly and portable electronic device | Yi-Lun Cheng | 2021-01-26 |