Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11207822 | Method and system for fabricating mixed-material 3D object | Wei Chen, Xiaokun Chen, Darong MA | 2021-12-28 |
| 11200190 | Command based on-die termination for high-speed NAND interface | Gang Zhao, Jie Chen, Lin Chen | 2021-12-14 |
| 11092560 | Device and method for realizing high-speed temperature drop of micro material by droplet cooling | Dongshan Zhou, Evgeny Zhuravlev, Jing Jiang, Shaochuan Luo, Christoph Schick +4 more | 2021-08-17 |
| 11048654 | Systems and methods for providing multiple memory channels with one set of shared address pins on the physical interface | Shawn Chen, Lin Chen | 2021-06-29 |
| 11043435 | Semiconductor die with hybrid wire bond pads | Lin Chen, Gang Zhao, Shiann-Ming Liou | 2021-06-22 |
| 10919213 | Method and system for fabricating colored 3D object | Wei Chen, Jia Hsing Li, Xiaokun Chen, Yi Zhou | 2021-02-16 |
| 10920974 | Intelligently-connected vehicle LED headlight using graphene | Wei Rur Chen, Libin Zhou | 2021-02-16 |