Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Evelyn Napetschnig +1 more | 2021-02-09 |
SS
Siew Ching Seah
Overall (2021): #256,731 of 548,734Top 50%
1
Patents 2021