Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Evelyn Napetschnig, Nurfarena Othman +1 more | 2021-02-09 |
MS
Muhammad Muhammat Sanusi
Overall (2021): #323,494 of 548,734Top 60%
1
Patents 2021