Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069644 | Semiconductor device including a solder compound containing a compound Sn/Sb | Thomas Behrens, Alexander Heinrich, Bernhard Weidgans, Catharina Wille, Christina Yeong | 2021-07-20 |
| 10930614 | Chip arrangements | Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Oliver Eichinger +2 more | 2021-02-23 |
| 10914018 | Porous Cu on Cu surface for semiconductor packages | Norbert Pielmeier, Chin Yung Lai, Swee Kah Lee, Muhammad Muhammat Sanusi, Nurfarena Othman +1 more | 2021-02-09 |