Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081417 | Manufacturing a package using plateable encapsulant | Sook Woon Chan, Chau Fatt Chiang, Kok Yau Chua, Soon Lock Goh, Swee Kah Lee +3 more | 2021-08-03 |
BS
Beng Keh See
Overall (2021): #517,212 of 548,734Top 95%
1
Patents 2021