Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985057 | Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC | Anne Jourdain, Nouredine Rassoul | 2021-04-20 |
| 10886252 | Method of bonding semiconductor substrates | Lan Peng, Soon-Wook Kim, Gerald Beyer, Erik Sleeckx, Robert C. Miller | 2021-01-05 |