GB

Gerald Beyer

IV Imec Vzw: 1 patents #53 of 216Top 25%
📍 Heverlee, BE: #11 of 44 inventorsTop 25%
Overall (2021): #450,779 of 548,734Top 85%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10886252 Method of bonding semiconductor substrates Lan Peng, Soon-Wook Kim, Eric Beyne, Erik Sleeckx, Robert C. Miller 2021-01-05