Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985057 | Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC | Anne Jourdain, Eric Beyne | 2021-04-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985057 | Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC | Anne Jourdain, Eric Beyne | 2021-04-20 |