Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171104 | IC chip package with dummy solder structure under corner, and related method | Manish Nayini, Janak G. Patel, Nazmul Habib | 2021-11-09 |
| 10978416 | Dual bond pad structure for photonics | Jeffrey P. Gambino, Robert K. Leidy, Jeffrey C. Maling | 2021-04-13 |