Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171104 | IC chip package with dummy solder structure under corner, and related method | Richard S. Graf, Janak G. Patel, Nazmul Habib | 2021-11-09 |
MN
Manish Nayini
Overall (2021): #345,127 of 548,734Top 65%
1
Patents 2021