Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171104 | IC chip package with dummy solder structure under corner, and related method | Manish Nayini, Richard S. Graf, Nazmul Habib | 2021-11-09 |
| 11049819 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2021-06-29 |