Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11162191 | Thermal processing method for silicon wafer | Susumu Maeda, Hironori Banba, Haruo Sudo, Hideyuki Okamura, Koji Araki +1 more | 2021-11-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11162191 | Thermal processing method for silicon wafer | Susumu Maeda, Hironori Banba, Haruo Sudo, Hideyuki Okamura, Koji Araki +1 more | 2021-11-02 |